Title:
SEMICONDUCTOR-SEALING, FLAME-RETARDANT EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2003327797
Kind Code:
A
Abstract:
To obtain a cured product showing excellent flame retardance and reliability in terms of humidity resistance by using a semiconductor-sealing, flame-retardant epoxy resin composition showing excellent moldability.
The epoxy resin composition essentially comprises (A) an epoxy resin, (B) a hardener, (C) an inorganic filler, (D) an organopolysiloxane or (F) a block copolymer obtained through addition reaction of an SiH group of the organopolysiloxane and an alkenyl group of an alkenyl group-containing epoxy compound and (E) a phosphazene compound and is substantially free from bromides and antimony compounds. A semiconductor device is sealed with the cured product of the composition.
Inventors:
TAKENAKA HIROYUKI
OSADA MASAKAZU
ANDO SHINGO
OSADA MASAKAZU
ANDO SHINGO
Application Number:
JP2002141483A
Publication Date:
November 19, 2003
Filing Date:
May 16, 2002
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08L63/00; C08K3/00; C08K5/5399; C08L83/06; C08L85/02; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08K3/00; C08K5/5399; C08L83/06; C08L85/02; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Takashi Kojima (2 outside)