PURPOSE: To make it possible to apply characters of good contrast even when they are applied by means of laser, by incorporating an organic pigment of relatively low heat resistance or carbon black and a light-color pigment of high heat resistance.

CONSTITUTION: A semiconductor sealing material mainly consisting of a cresol epoxy resin, a phenol novolak resin and an inorganic filler is further mixed with an organic pigment of relatively low heat resistance (e.g., Direct Black or phthalocyanine oxidation dye) or carbon black and a light-color pigment of high heat resistance (e.g., titanium oxide or red iron oxide). When characters are applied to a semiconductor device sealed with this material by means of an energy body such as laser, the black pigment of low heat resistance is decomposed and the white, red, or like color light-color pigment is exposed prominently to the surface so that the characters obtained show good contrast.