Title:
SEMICONDUCTOR SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2015101668
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor sealing resin composition capable of forming a semiconductor sealing material excellent in heat resistance, a semiconductor sealing material formed using the semiconductor sealing resin composition, and an excellently reliable semiconductor device in which elements are sealed with the semiconductor sealing material.SOLUTION: A semiconductor sealing resin composition contains a bismaleimide-based compound represented by the general formula (1), a benzoxazine-based compound represented by the general formula (2), a curing catalyst, and an inorganic filler.
Inventors:
TAKAHAMA KEIZO
YAMASHITA KATSUSHI
OZAKI YUI
YAMASHITA KATSUSHI
OZAKI YUI
Application Number:
JP2013243751A
Publication Date:
June 04, 2015
Filing Date:
November 26, 2013
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G14/06; C08K3/00; C08K5/3415; C08L61/34; H01L23/29; H01L23/31