To provide a semiconductor substrate for manufacturing a vertical type device, in which a low ON-resistance of a vertical type MOSFET or the like is maintained, whereas a needed OFF breakdown strength can be ensured.
This semiconductor substrate is constituted, such that a high density arsenic layer 12 having a thickness of 0.5 to 3.0 μm is inserted in between a high density phosphorus layer 11 constituting the drain of the vertical-type MOSFET and an n-type drift layer 13. Thus, since the high-density arsenic layer 12 functions as a barrier layer which prevents phosphorus from spreading, from the high density phosphorus layer 11 to the n-type drift layer 13, the spread of a depletion layer, when turning off in the vertical-type MOSFET is ensured to enhance an OFF breakdown strength, and also the low ON resistance can be maintained.
JPS63138767A | 1988-06-10 | |||
JPH0582791A | 1993-04-02 | |||
JPH08241993A | 1996-09-17 | |||
JPH04320377A | 1992-11-11 |