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Title:
SEMICONDUCTOR-SUBSTRATE DRY ETCHING APPARATUS
Document Type and Number:
Japanese Patent JPH0684838
Kind Code:
A
Abstract:

PURPOSE: To achieve that a plasma light quantity extracted from an etching treatment chamber is made always definite when an etching end point is detected and to stably detect the etching end point in a semiconductor-substrate dry etching apparatus.

CONSTITUTION: Plasma light generated from an etching treatment chamber 1 is transmitted through a light-shielding plate 3 and reaches an etching end point detector 4. The plasma light is converted into an electric signal by an optical/electric converter 5. The electric signal is taken into a position control part 6, controls a driving mechanism part 7 and drives the light-shielding plate 3 to the up-and-down direction. Thereby, optimum plasma light reaches the etching end point detector 4 and the etching end point detection of the title apparatus is stabilized.


Inventors:
TAKAGI MASAYOSHI
Application Number:
JP23446492A
Publication Date:
March 25, 1994
Filing Date:
September 02, 1992
Export Citation:
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Assignee:
KYUSHU NIPPON ELECTRIC
International Classes:
C23F4/00; H01L21/302; H01L21/3065; (IPC1-7): H01L21/302; C23F4/00
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)



 
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