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Title:
半導体基板
Document Type and Number:
Japanese Patent JP4922979
Kind Code:
B2
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Inventors:
Kazuhiro Nagase
Hirotaka Soga
Application Number:
JP2008087396A
Publication Date:
April 25, 2012
Filing Date:
March 28, 2008
Export Citation:
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Assignee:
Asahi Kasei Electronics Co., Ltd.
International Classes:
C30B29/40; C23C14/06; H01L21/20; H01L21/203; H01L21/205; H01L21/338; H01L29/201; H01L29/778; H01L29/812
Domestic Patent References:
JP2005085916A
JP2001291667A
JP5090301A
JP2008508700A
Foreign References:
WO2005027228A1
Attorney, Agent or Firm:
Yoshikazu Tani



 
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