Title:
SEMICONDUCTOR SUBSTRATE
Document Type and Number:
Japanese Patent JPS6039817
Kind Code:
A
Abstract:
PURPOSE:To prevent any erroneous operation of an operator determining a substrate direction from happening by a method wherein a notch indicating the crystalline axis direction is linearly provided on the part excluding the referential facet forming part not to reach the first main surface from the second main surface. CONSTITUTION:A notch not to reach the first main surface from the second main surface is provided on the part excluding the peripheral facet 12 forming part of a semiconductor substrate 11 while a linear end 13a indicating the crystalline axis direction of the semiconductor substrate 11 is formed on the second main surface. A notch 13 is formed into around 10-400mum thick not to have any influence upon processing of the first main surface of the substrate 11 such as patterning process etc. Through these procedures, the linear end 13a may indicate the cryatalline axis direction preventing any erroneous operation of an operator in determining the substrate 11 direction from occurring since the facet 12 is the only one linear end of the first main surface.
Inventors:
OOMORI MASASHI
Application Number:
JP14856683A
Publication Date:
March 01, 1985
Filing Date:
August 12, 1983
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/02; (IPC1-7): H01L21/02
Attorney, Agent or Firm:
Masuo Oiwa
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