SEMICONDUCTOR SWITCHING DEVICE, SEMICONDUCTOR STACK DEVICE USING THE DEVICE AND POWER CONVERSION DEVICE

Japanese Patent JP3390653

B2

PROBLEM TO BE SOLVED: To provide a semiconductor switching device of the structure, wherein a coupling of a conductor with a semiconductor switching element is constituted into a simple structure and the assembly work for the switching device also is facilitated and becomes simple, a semiconductor stack device using this switching device and a power conversion device.
SOLUTION: A semiconductor switching device is constituted into a structure, wherein a cooling fin 140, cathode spacer rings 120, wiring boards 110, a GTO 100, gate terminals 101, elastic press rings 130 and a cooling fin 140 are pressure-bonded in a state that the cathode spacer rings 120, the wiring boards 110 and moreover, the GTO 100 are placed on the upper surface of the cooling fin 140 and thereafter, the the elastic press rings 130 are placed on the gate terminals 101 and moreover, the cooling fin 140 is superposed on the GTO 100, and the terminals 101 are pressure- bonded in the axial direction to contrive the connection of the terminals 101 with a cathode electrode 103 and the boards 110. Thereby, the connection of the terminals 101 with the electrodes 103 and the boards 110, the detachment of the terminals 101 from the electrode 103 and the boards 101 and the attachment of the terminals 101 to the electrode 103 and the boards 110 become possible by the operation of only assembly and disassembly of a stack and the work for the operation becomes very simple.

Yoshihiro Yoshida
Fumio Mizohata
Tomohiro Kobayashi

JP5813898A

March 24, 2003

March 10, 1998

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Mitsubishi Electric Corporation

H01L29/74; H01L29/744; H02M1/06; H05K1/02; H05K1/18; (IPC1-7): H01L29/74; H01L29/744; H02M1/06

JP8330572A

Toshihide Kodama (3 others)

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