To optimize the manufacture of an integrated circuit by a method wherein individual substrate pieces are fixed on a support for applying to a heat treatment process at a temperature higher than a specified temperature, and after those substrate pieces are subjected to prescribed treatment, the substrate pieces are separated from each other.
A plurality of receiving spaces 9 are formed on a support or a skate holder 2, those spaces 9 are formed into oblique or slant holes and oblique or slant substrate pieces 1 are respectively arranged in the oblique or slant holes. After a prescribed treatment comprising a heat treatment process for forming an integrated circuit at a temperature of 450°C or higher is performed to the substrate pieces 1, a layer 3 deposited on the rear of the holder 2 is removed by etching or a treatment similar to the etching and the individual substrate pieces 1 are separated from the holes formed in the spacers 9. As a result, the easily optimized integraed circuit can be manufactured.
MERTENS PAUL
HEYNS MARC
| JPS6356942A | 1988-03-11 |