To obtain a unit excellent in solder heat resistance, high-temperature reliability, heat impact resistance, moisture resistance reliability and continuous molding properties by coating a semiconductor device coated with a specific polyimide resin with an epoxy resin sealing resin composition containing a specific epoxy compound.

A composition is used which contains as a polyimide a polyimide obtained by dehydration or dealcoholization of a polyimide precursor of formula I and as an epoxy resin composition an epoxy resin containing a compound of formula II, a phenol-based curing agent, a curing accelerator and an inorganic filler. In the formulae, R1 is a trivalent or tetravalent organic group having at least 2 carbon atoms; R2 is a divalent organic group having at least 2 carbon atoms; X is an ammonium ion having an organic group having a double bond, H or a monovalent organic group having a double bond; n is 1 or 2; and R3 to R10 are each H, a monovalent organic group or a halogen.