Title:
SEMICONDUCTOR UNIT
Document Type and Number:
Japanese Patent JP2017126681
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent concentrated application of a stress, incident to deformation of a heat slinger, onto the joint of the heat slinger, when cooling the heat slinger, on which a semiconductor device is placed, by a water-cooling structure on the reverse side.SOLUTION: Power conversion devices 1u, 1v, 1w, where semiconductor modules 13u, 13v, 13w are mounted on insulating substrates 11u, 11v, 11w by solders 15u, 15v, 15w, are placed in the central part of the surface 31a of a heat slinger 31 via joint materials 17u, 17v, 17w. Radiation fins 31c on the reverse surface 31b of the heat slinger 31 is housed in a cooling water channel 33b of an enclosure 33 coupled to the heat slinger 31, and an annular groove 31d exposing to the cooling water channel 33b is formed on the outside of the joint materials 17u, 17v, 17w, or the radiation fins 31c on the reverse surface 31b of the heat slinger 31. Internal stress occurring in the heat slinger 31 due to temperature difference of the surface 31a and reverse surface 31b caused by heat generation of the semiconductor modules 13u, 13v, 13w is absorbed by deformation of a portion of the annular groove 31d.SELECTED DRAWING: Figure 2
Inventors:
SATO YUTAKA
OI YASUYUKI
ANZAI TAKESHI
OI YASUYUKI
ANZAI TAKESHI
Application Number:
JP2016005726A
Publication Date:
July 20, 2017
Filing Date:
January 15, 2016
Export Citation:
Assignee:
CALSONIC KANSEI CORP
International Classes:
H01L23/473; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu