Title:
SEMICONDUCTOR WAFER GUIDE AND WET TYPE SEMICONDUCTOR CLEANING APPARATUS USING THE SAME
Document Type and Number:
Japanese Patent JP2003197595
Kind Code:
A
Abstract:
To provide a wafer guide for minimizing the contact potion between the wafer and a center portion fixing groove.
This wafer guide is provided with a pair of side portion supporting bases 30a, 30b being separated with a predetermined interval and having V-shape grooves 31a, 31b formed on the upper surfaces thereof, a center portion supporting base 32 being located between the side portion supporting bases 30a, 30b, projected toward inside, having a center portion fixing groove 33 formed on the upper surface thereof to form one contact line with wafer, and a pair of fixing plates 34a, 34b coupled in both sides of the side portion supporting bases 30a, 30b and the center potion supporting base 32.
Inventors:
MOON BONG-HO
KO YOSEN
LEE WON-JUN
JUN YONG-MYUNG
HWANG IN-SEAK
KO YOSEN
LEE WON-JUN
JUN YONG-MYUNG
HWANG IN-SEAK
Application Number:
JP2002337824A
Publication Date:
July 11, 2003
Filing Date:
November 21, 2002
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
H01L21/306; B08B3/04; H01L21/00; H01L21/304; H01L21/673; (IPC1-7): H01L21/304; H01L21/306
Attorney, Agent or Firm:
Mikio Hatta (4 outside)
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