Title:
SEMICONDUCTOR WAFER LOADING-UNLOADING DEVICE AND JIG STRUCTURE
Document Type and Number:
Japanese Patent JPH04280651
Kind Code:
A
Abstract:
PURPOSE: To provide a semiconductor wafer loading-unloading device which automatically loads or unloads a semiconductor wafer on or from the jig of a processing device so as to prevent troubles such as the production of dust and a wrong operation by an operator.
CONSTITUTION: A wafer loading-unloading device unloads a semiconductor wafer 11 from a wafer carrier where the wafers 11 are housed one by one, transfers it to an orientation flat alignment section 15, and positions it in a certain direction. Then, the wafer 11 is mounted on a jig 18 at a prescribed position as its outer circumference is pinched by a robot arm.
Inventors:
AKAZAWA TSUTOMU
Application Number:
JP4373891A
Publication Date:
October 06, 1992
Filing Date:
March 08, 1991
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L21/285; H01L21/68; (IPC1-7): H01L21/285; H01L21/68
Attorney, Agent or Firm:
Kenji Onishi