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Patent Searching and Data


Title:
SEMICONDUCTOR WAFER AND MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF SEMICONDUCTOR OPTICAL AMPLIFIER
Document Type and Number:
Japanese Patent JP2002280672
Kind Code:
A
Abstract:

To provide a semiconductor wafer manufactured by a simplified device manufacturing process, a method of manufacturing a semiconductor wafer, and a method of manufacturing a semiconductor optical amplifier.

Light of different light intensities P is irradiated to a predetermined region at the same time from a time Ta before supplying a raw material gas (TMIn, TEG, AsH3) for growing a strain bulk active layer (In1-xGaxAsyP1-y) to a time Tb after stopping the supply of the material gas to produce a local composition modulation, thereby forming a wafer having a desired amount of strain positively and widely.


Inventors:
ITO MASAYUKI
TOMORI YUICHI
Application Number:
JP2001076232A
Publication Date:
September 27, 2002
Filing Date:
March 16, 2001
Export Citation:
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Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
C23C16/30; H01L21/205; H01S5/323; H01S5/50; (IPC1-7): H01S5/323; C23C16/30; H01L21/205; H01S5/50
Attorney, Agent or Firm:
Takayama Michio