Title:
半導体ウエハ処理方法および半導体ウエハ乾燥装置
Document Type and Number:
Japanese Patent JP5334728
Kind Code:
B2
Inventors:
Shintaro Tsuboi
Junpei Sato
Kazuya Tashiro
Junpei Sato
Kazuya Tashiro
Application Number:
JP2009175473A
Publication Date:
November 06, 2013
Filing Date:
July 28, 2009
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L21/304; F26B5/14; F26B9/06
Domestic Patent References:
| JP2006054344A | ||||
| JP61059339U | ||||
| JP2007305949A | ||||
| JP8031788A | ||||
| JP2007335720A |