SEMICONDUCTOR WAFER TREATING DEVICE EQUIPPED WITH DUST-PROOFING FUNCTION

Japanese Patent JP2004140378

A

To solve the problem that, when the opening of the wafer treating section of the conventional semiconductor wafer treating device in which the treating section is hermetically sealed in a pressurized state for keeping the cleanliness of the inside of the section at a high level, an air current occurs instantaneously when the opening is opened due to the differential pressure between the inside and outside of the section and dust gets in a clean box and contaminates wafers.

The semiconductor wafer treating device is provided with a chamber pressurized to a higher pressure than the outside, an opening 2 connecting the inside of the chamber to the outside, and a door 3 which covers the opening 2. The opening 2 is provided with a partial opening 1 which is not shut up by the door 3 when the door 3 covers the opening 2. Consequently, the contamination of the wafers can be prevented by suppressing the occurrence of air currents.

OKABE TSUTOMU
IGARASHI HIROSHI

JP2003376935A

May 13, 2004

November 06, 2003

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TDK CORP

H01L21/677; H01L21/02; H01L21/68; (IPC1-7): H01L21/68; H01L21/02

Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa
Takao Matsui

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