Title:
半導体ウェーハ及びその製造方法
Document Type and Number:
Japanese Patent JP5505334
Kind Code:
B2
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Inventors:
Michito Sato
Takashi Araya
Takashi Araya
Application Number:
JP2011040609A
Publication Date:
May 28, 2014
Filing Date:
February 25, 2011
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
H01L21/304; B24B1/00; B24B9/00
Domestic Patent References:
JP2004241723A | ||||
JP2005032882A | ||||
JP2011134828A | ||||
JP2012109310A | ||||
JP2012129416A |
Attorney, Agent or Firm:
Mikio Yoshimiya