Title:
電子デバイス用のセンサアセンブリ
Document Type and Number:
Japanese Patent JP7002578
Kind Code:
B2
Abstract:
Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.
Inventors:
Browning, Lucy Elizabeth
Pope, Benjamin Jay.
Loit Hoiser, Paul You.
Mayers, Scott A.
Din, Richard Han Min
Huo, Edward S.
Pope, Benjamin Jay.
Loit Hoiser, Paul You.
Mayers, Scott A.
Din, Richard Han Min
Huo, Edward S.
Application Number:
JP2020032133A
Publication Date:
January 20, 2022
Filing Date:
February 27, 2020
Export Citation:
Assignee:
Apple Inc.
International Classes:
G06F3/01; G06F3/041; G06F3/0354; G06F3/044; H01L29/84
Domestic Patent References:
| JP2016009444A | ||||
| JP2000347807A | ||||
| JP2011028663A |
Foreign References:
| WO2016016612A1 | ||||
| WO2015192548A1 | ||||
| US20150071509 |
Attorney, Agent or Firm:
Patent Business Corporation Otsuka International Patent Office
Yasunori Otsuka
Yasuhiro Otsuka
Shiro Takayanagi
Shuji Kimura
Osamu Shimoyama
Nagakawa Yumitsu
Yasunori Otsuka
Yasuhiro Otsuka
Shiro Takayanagi
Shuji Kimura
Osamu Shimoyama
Nagakawa Yumitsu
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