Title:
SENSOR
Document Type and Number:
Japanese Patent JP2016225634
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sensor having an integrated component coupled to a lead frame.SOLUTION: A sensor 700 includes: a die 704; a lead frame 706 which has a first surface and a second surface facing each other and supports the die by the first surface; a plurality of lead fingers 708a, 708b, and 708c which provide electrical connection with the lead frame and electrical connection with the die; a component 702 coupled to the lead frame and the first finger 708a of the lead finger so as to minimize a distance between an IC package and an interested object for serving as an integrated part of the IC package; and an external lead which is located at an opposite side of the die relative to the component coupled to the lead frame.SELECTED DRAWING: Figure 7
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Inventors:
NIRMAL SHARMA
VIRGIL ARARAO
MAGPANTAY LEONARDO T
ENGEL RAYMOND W
TAYLOR WILLIAM P
KIRSTEN DOOGUE
GAGNON JAY
VIRGIL ARARAO
MAGPANTAY LEONARDO T
ENGEL RAYMOND W
TAYLOR WILLIAM P
KIRSTEN DOOGUE
GAGNON JAY
Application Number:
JP2016131260A
Publication Date:
December 28, 2016
Filing Date:
July 01, 2016
Export Citation:
Assignee:
ALLEGRO MICROSYSTEMS LLC
International Classes:
H01L25/00; G01R33/07; G01R33/09; H01L23/50; H01L43/02; H01L43/04
Domestic Patent References:
JPH0979865A | 1997-03-28 | |||
JPH06216308A | 1994-08-05 | |||
JP2006032775A | 2006-02-02 | |||
JPS6130067A | 1986-02-12 | |||
JPH0298680A | 1990-04-11 |
Foreign References:
WO2006042839A1 | 2006-04-27 |
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Kenichi Torii
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Kenichi Torii
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