Title:
SEPARATING DEVICE FOR SEMICONDUCTOR LASER PART
Document Type and Number:
Japanese Patent JP3387156
Kind Code:
B2
Abstract:
PURPOSE: To provide a separating device for the semiconductor laser parts which can separate a plurality of semiconductor laser parts cut out from a wafer, one by one, without damaging the semiconductor laser parts.
CONSTITUTION: A separating device for semiconductor laser parts is equipped with a part placing table 3 on which a plurality of semiconductor laser parts 2 are arranged in a closely attached state, part driving-out mechanism 4 for shifting the part placing table 3 in the arrangement direction X of the semiconductor laser part 2, and a rotary wheel 5 which has suction holes 7 for sucking the semiconductor laser parts 2 driven out by the part driving-out mechanism 4 one by one, on the outer peripheral surface.
Inventors:
Kunio Tsuboi
Application Number:
JP16411293A
Publication Date:
March 17, 2003
Filing Date:
June 07, 1993
Export Citation:
Assignee:
ソニー株式会社
International Classes:
B65G29/00; B65G47/08; B65G47/86; B65G47/88; H05K13/02; (IPC1-7): B65G47/86; H05K13/02
Domestic Patent References:
| JP3270833A | ||||
| JP5986509A | ||||
| JP63162436A | ||||
| JP1132916A | ||||
| JP62244482A | ||||
| JP6356117U | ||||
| JP2502626A |
Attorney, Agent or Firm:
Kuninori Funabashi
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