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Patent Searching and Data


Title:
SEPARATION OF RESIN BONDED TO METALLIC MATERIAL OR THE LIKE
Document Type and Number:
Japanese Patent JPH06278137
Kind Code:
A
Abstract:

PURPOSE: To enable metal and resin to be reused by a method wherein the metal is separated from the resin in a resin composite in which the resin is bonded to the metal or the like.

CONSTITUTION: A resin composite (m) wherein resin 2 is bonded to a heat resistant material 1 such as a metallic material or the like, is cut to pieces of a suitable size. The product cut to pieces (m1) is contained in a processing container 5 of a centrifugal separator 4, heated at a suitable temperature, or heated under a suitably pressurized state. The resin which has been made a melted state is separated from the heat resistant material with centrifugal force.


Inventors:
SHIMIZU AKIRA
HIRAI HIDENORI
Application Number:
JP10971693A
Publication Date:
October 04, 1994
Filing Date:
March 29, 1993
Export Citation:
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Assignee:
KATAYAMA KOGYO KK
International Classes:
C09J5/00; B29B17/02; B29B17/04; C08J11/12; B29K105/26; (IPC1-7): B29B17/02; C08J11/12; C09J5/00
Attorney, Agent or Firm:
Eiji Omura