To properly hold a processed substrate separated from a superposed substrate and properly perform conveyance or processing of the processed substrate.
The separation system include holding parts 60 which hold a processed wafer W in a non-contact state when conveying or processing the processed wafer W separated from a superposed wafer. On a holding surface 61 of the holding part 60, a plurality of ejection ports 62 ejecting gas and a plurality of suction ports 63 sucking the gas are formed. The plurality of ejection ports 62 and the plurality of suction ports 63 are formed over the entire positions corresponding to the processed wafer W held by the holding part 60. In the separation system, the holding parts 60 are provided in a conveyance device conveying the processed wafer W, an inverting device inverting front and back faces of the processed wafer W, a separation device separating the superposed wafer into the processed wafer W and a support wafer, a washing device washing the processed wafer W, and an inspection device inspecting the processed wafer W.
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Miaki Kametani
Koji Hagiwara
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