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Title:
電子部品用セパレータ及びその製造方法
Document Type and Number:
Japanese Patent JP4495516
Kind Code:
B2
Abstract:

To provide a separator for electronic components easy to reduce its thickness and excellent in mechanical strength, dimensional stability, and heat resistance; and to provide a method for manufacturing the separator capable of providing uniform porous structure and excellent in productivity.

The separator is a porous film, containing filler particles with a melting point of 180°C or above or no substantial melting point, which is made of a resin compound with a glass transition point of 180°C or above. The method for manufacturing the separator for electronic components which forms a porous film by coating on a base material and drying a paint containing a resin compound with a glass transition point of 180°C or above, filler particles with a melting point of 180°C or above, at least one of good solvents which dissolves the resin compound well, and at least one of poor solvents which dissolves the resin compound little.

COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Jin Sugiyama
Hiromi Totsuka
Takanori Masanori
Kazuhiko Fukaya
Application Number:
JP2004145430A
Publication Date:
July 07, 2010
Filing Date:
May 14, 2004
Export Citation:
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Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
C08L101/00; H01M2/16; C09D7/12; C09D201/00; H01G9/00; H01G9/02
Domestic Patent References:
JP2003157826A
JP63040270A
JP2000182672A
JP2003100348A
JP2004051791A