Title:
SETUP SUPPORT DEVICE FOR PRINTING MACHINE AND METHOD
Document Type and Number:
Japanese Patent JP2023017340
Kind Code:
A
Abstract:
To make it possible to reduce time required for setup work performed in accordance with a change in a type of a board on which solder printing is performed by a printing machine.SOLUTION: An order in which solder printing is executed on a plurality of types of substrates B (1) to B (4) is determined on the basis of squeegee 61 (first printing condition) of a plurality of printing conditions (squeegee 61 and solder D) including the squeegee 61 and the solder D used to execute solder printing. Therefore, on the basis of the squeegee 61 prepared in accordance with the change of a substrate B on which solder printing is executed, the order of executing solder printing on the plurality of types of substrates B (1) to B (4) is made appropriate so that time required for a squeegee 61 preparation can be reduced.SELECTED DRAWING: Figure 5
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Inventors:
FUJIMOTO TAKESHI
Application Number:
JP2021121546A
Publication Date:
February 07, 2023
Filing Date:
July 26, 2021
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD
International Classes:
H05K3/34; B41F15/08; B41F15/12
Attorney, Agent or Firm:
Swing angle Shoichi
Kazumasa Onishi
Kazumasa Onishi