Title:
３Ｄ物体強度を増大させるための縫製方法及び装置
Document Type and Number:
Japanese Patent JP7273754
Kind Code:
B2
Abstract:
An addition to additive manufacturing sews a number of printed substrate sheets together using industrial sewing machine technology. Portions of the final 3D object that will be solid are sewn together into bundles of the object with a needle protruding through the top of the bundle via a sewing machine with a looping mechanism connecting the thread loops under each bundle of printed substrate sheet layers. This will result in many well connected stack bundles that are then stacked in alignment to form the final stack. During heat and compression, the stitch thread may bunch together and become entangled with the cooled plastic of the final solid 3D object. Removal of the excess substrate may proceed as usual, since the sewing is applied only in the solid portions of the final object. The end result will be a part with much higher strength in the Z axis.
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Inventors:
Mark Dee Daniels
Application Number:
JP2020041427A
Publication Date:
May 15, 2023
Filing Date:
March 11, 2020
Export Citation:
Assignee:
XEROX CORPORATION
International Classes:
B29C64/147; B29C64/223; B29C64/236; B29C64/393; B33Y10/00; B33Y30/00; B33Y50/02; B65H37/04
Domestic Patent References:
| JP2019505416A | ||||
| JP2015183186A | ||||
| JP2017218269A |
Foreign References:
| CN204733994U |
Attorney, Agent or Firm:
Shinichiro Tanaka
Hiroyuki Suda
Fumiaki Otsuka
Takayoshi Nishijima
Hiroshi Uesugi
Naoki Kondo
Takeo Nasu
Takuji Toyoshima
Hiroyuki Suda
Fumiaki Otsuka
Takayoshi Nishijima
Hiroshi Uesugi
Naoki Kondo
Takeo Nasu
Takuji Toyoshima