To shorten a time of assembling operation by superposing a flexible circuit board and a shape memory alloy sheet in a flat state, obtaining a solid composite unit when the sheet is shape-restored, and incorporating the unit in a container.

A shape memory alloy sheet 200 is disposed on an outer periphery of a flexible circuit board 100, and components such as a preamplifier and a signal processor are mounted in the board 100. The sheet 200 corresponding to a part for mounting the components is formed flatly, and the board 100 and sheet 200 are superposed and adhered with adhesive 302 only by the flat part. A solid composite unit when the sheet 200 is shape-restored is obtained, and the unit is contained in a container in an electronic equipment.