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Title:
SHEET MOLDING COMPOUND FOR DECORATIVELY MOLDING AND MANUFACTURE OF DECORATED MOLDING USING IT
Document Type and Number:
Japanese Patent JPH11320553
Kind Code:
A
Abstract:

To reduce the number of materials and a cost and to improve an operating efficiency by using a decorating film for one of carrier films in the case of manufacturing a sheet molding compound, placing the decorating film in a mold so that it becomes a surface of a decorative molding, and molding it by pressure heating.

In the sheet molding compound(SMC) sandwiched between carrier films, a decorating film for forming a surface of a molding is used for one of carrier films to constitute a decoratively molding SMC. The SMC is placed in a mold so that the decorating film becomes a surface of a molding, the other carrier film is removed, an another SMC in which the same carrier film is removed is placed at this removed part, pressure heat molded to manufacture the decorative molding. Thus, occurrence of a positional deviation, a wrinkle, a bulge or the like at the molding is prevented, and economy and operability of the pressure heat molding are improved.


Inventors:
HASEGAWA HIROSHI
Application Number:
JP13329498A
Publication Date:
November 24, 1999
Filing Date:
May 15, 1998
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B29B11/16; B29C43/18; B29C43/20; C08J5/04; B29K67/00; B29K105/06; B29L7/00; B29L31/10; (IPC1-7): B29B11/16; B29C43/18; B29C43/20; C08J5/04
Attorney, Agent or Firm:
Kunihiko Wakabayashi



 
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