Title:
SHEET MOLDING COMPOUND TO BE COATED IN MOLD
Document Type and Number:
Japanese Patent JPH04252233
Kind Code:
A
Abstract:
PURPOSE:To provide a SMC to be coat-molded in a mold, giving press-molded products having whiskers projected from the surfaces of the molded products, thereby giving good adhesivity between the coating layer and the SMC, by adding a specific amount of the whiskers to a resin composition including a thermosetting resin. CONSTITUTION:A sheet molding compound(SMC) to be coated in a mold comprises (A) 100 pts.wt. of a resin comprising an unsaturated polyester resin having reactive double bonds in a molecule, a thermosetting resin such as a vinyl ester (epoxycyanoacrylate) resin and, if necessary, a thermoplastic resin and a copolymerizable monomer (e.g. styrene) compounded with (B) 5-200 pts.wt., preferably 10-100 pts.wt., of optionally surface-treated whiskers (e.g. zinc oxide whisker) having a length of 1-500mum, if necessary, glass fiber rovings cut into approximately 25mm, an inorganic filler, a curing agent, etc. Since the whiskers are projected from the surface of the SMC when press-molded, the adhesivity between the coated layer and the SMC is strengthened.
Inventors:
YAMAMOTO KAZUYOSHI
MORISHITA NATSUKI
MORISHITA NATSUKI
Application Number:
JP846691A
Publication Date:
September 08, 1992
Filing Date:
January 28, 1991
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B29C39/10; B29C39/12; B29C43/18; B29C43/20; C08J5/04; B29K67/00; B29K105/08; B29K105/12; B29L9/00; (IPC1-7): B29C39/10; B29C39/12; B29C43/18; B29C43/20; B29K67/00; B29K105/08; B29K105/12; B29L9/00; C08J5/04
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