Title:
SHEET PEELING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP2011073872
Kind Code:
A
Abstract:
To suppress the lowering of yield in production of a semiconductor chip due to fall of dust in an adherend such as a semiconductor wafer.
This sheet peeling device 10 includes a sticking means 15 for sticking a peeling tape PT on a protection sheet S stuck on the semiconductor wafer W, and a peeling means 16 for peeling the protection sheet S from the semiconductor wafer W via the tape PT stuck on the protection sheet S. The peeling means 16 is provided so that the protection sheet S may be peeled from the semiconductor wafer W while the sticking face of the protection sheet S of the semiconductor wafer W is directed downward.
Inventors:
TAKANO TAKESHI
Application Number:
JP2009230085A
Publication Date:
April 14, 2011
Filing Date:
October 02, 2009
Export Citation:
Assignee:
LINTEC CORP
International Classes:
B65H41/00; B65H37/04; H01L21/683
Domestic Patent References:
| JP2004149293A | 2004-05-27 | |||
| JP2006232509A | 2006-09-07 | |||
| JP2009070837A | 2009-04-02 | |||
| JP2006179517A | 2006-07-06 |
Attorney, Agent or Firm:
Yoshio Yamaguchi
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