Title:
SHIELD DEVICE AND METHOD FOR MANUFACTURING SHIELD DEVICE
Document Type and Number:
Japanese Patent JP2017084655
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To connect a conductive layer and a conductive member provided on a surface of a resin component while suppressing the conductive layer from being peeled off.SOLUTION: A shield device 20 includes: a resin component (for example, a connector housing 32); a conductive member (for example, a cylindrical braid 50) fixed to a surface of the resin component; and a conductive layer 70 covering the surface of the resin component together with a portion that is fixed to the surface of the resin component in the conductive member. The conductive layer 70 is, for example, a plating layer.SELECTED DRAWING: Figure 1
Inventors:
SHIMIZU TAKESHI
SUETANI MASAHARU
KAWAGUCHI TOMOYA
SUETANI MASAHARU
KAWAGUCHI TOMOYA
Application Number:
JP2015213014A
Publication Date:
May 18, 2017
Filing Date:
October 29, 2015
Export Citation:
Assignee:
AUTO NETWORK GIJUTSU KENKYUSHO KK
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01R13/648; H05K9/00
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita