Title:
シールド導電路
Document Type and Number:
Japanese Patent JP6662311
Kind Code:
B2
Abstract:
A shield conduction path that includes a wire; and a pipe with a circular cross-section that accommodates the wire. The pipe is formed by combining a first divided body and a second divided body that are divided in a diameter direction using, as boundaries, divided surfaces that extend in an axial direction of the pipe. The first divided body and the second divided body include a metal material that can be held in a combined state through welding, and a circumferential length of the first divided body is set to be longer than a circumferential length of the second divided body.
Inventors:
Hidetoshi Sugino
Application Number:
JP2017003226A
Publication Date:
March 11, 2020
Filing Date:
January 12, 2017
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS,LTD.
International Classes:
H01B7/18; H01B7/20; H02G3/04; H05K9/00
Domestic Patent References:
| JP2004257455A |
Attorney, Agent or Firm:
Patent Business Corporation Grund Patent Office