Title:
SHORT CIRCUIT DETECTING DEVICE FOR BONDING WIRE
Document Type and Number:
Japanese Patent JP3257879
Kind Code:
B2
Abstract:
PURPOSE: To detect an instantaneous short circuit and a permanent short circuit by the inspection device of an electronic device by wire-connecting the electrode of various chips mounted on a substrate and the electrode on the substrate.
CONSTITUTION: The title short circuit detecting device is provided with a voltage application circuit 3 with which test voltage is applied to the bonding wire 15 or a conductive pattern 16 of the part to be inspected, a converting circuit 4 with which at least the change of current flowing to the bonding wire 15 and the conductive pattern 16 is converted to voltage change, a comparator 5 formed in such a manner that output signal level is inverted when the output voltage of the converting circuit 4 exceeds the reference voltage value, and a retaining circuit 6 which is formed to store the output level of the comparator 5 until it is reset. The instantaneous short circuit between the bonding wire 15 and the conductive pattern can be detected by the output signal level of the retaining circuit.
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Inventors:
Kashimi Hirata
Application Number:
JP25737393A
Publication Date:
February 18, 2002
Filing Date:
October 15, 1993
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H01L21/66; H01L21/60; (IPC1-7): H01L21/66; H01L21/60
Domestic Patent References:
| JP61237438A | ||||
| JP5039073A | ||||
| JP595638A | ||||
| JP61237440A |
Attorney, Agent or Firm:
Takao Watanuki (1 outside)