Title:
信号伝送基板およびその製造方法
Document Type and Number:
Japanese Patent JP7037773
Kind Code:
B2
Abstract:
To provide a signal transmission board and manufacturing method thereof, capable of achieving both higher signal transmission efficiency and suppression of board warpage.SOLUTION: A signal transmission board 10 includes: a board 12 having a first surface 13 and a second surface 14 at the opposite side of the first surface 13; a first signal layer 331 disposed on the first surface 13; a first isolation layer 36 disposed on the first signal layer 331; a first ground layer 351 disposed on the first isolation layer 36; a second signal layer 431 disposed on the second surface 14, electrically connected to the first signal layer 331, having larger width than the first signal layer 331 in direction of crossing to the signal transmission; a second isolation layer 44 disposed on the second signal layer 431, having larger dimension than the first isolation layer 36 in direction of thickness crossing to the first surface 13 and having smaller coefficient of elasticity; and a second ground layer 451 disposed on the second isolation layer 44.SELECTED DRAWING: Figure 1
Inventors:
Kuramochi Satoru
Application Number:
JP2020215640A
Publication Date:
March 17, 2022
Filing Date:
December 24, 2020
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H05K3/46; H01P3/08; H01P5/02; H01P11/00
Domestic Patent References:
| JP2014192497A | ||||
| JP2005094445A |
Foreign References:
| US20060222821 |
Attorney, Agent or Firm:
Nakamura Yukitaka
Satoru Asakura
Yukihiro Hotta
Takeyuki Suzuki
Satoru Asakura
Yukihiro Hotta
Takeyuki Suzuki