Title:
信号伝送絶縁デバイス及びパワー半導体モジュール
Document Type and Number:
Japanese Patent JP5855285
Kind Code:
B2
Inventors:
Kenichi Suga
Takao Tsurimoto
Yuki Shioda
Kenichi Morokuma
Nishikawa Kazuyasu
Shoichi Orita
Noritaka Tamaya
Shinya Nishida
Yoneyama Rei
Takashi Inoue
Uoda Shiori
Takao Tsurimoto
Yuki Shioda
Kenichi Morokuma
Nishikawa Kazuyasu
Shoichi Orita
Noritaka Tamaya
Shinya Nishida
Yoneyama Rei
Takashi Inoue
Uoda Shiori
Application Number:
JP2014557327A
Publication Date:
February 09, 2016
Filing Date:
October 31, 2013
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/822; H01F17/00; H01F19/04; H01F41/12; H01L21/768; H01L23/532; H01L27/04; H02M1/08
Domestic Patent References:
| JP2010080774A | 2010-04-08 | |||
| JP2001358215A | 2001-12-26 | |||
| JP2007258195A | 2007-10-04 | |||
| JPH0264525A | 1990-03-05 | |||
| JP2005079468A | 2005-03-24 |
Attorney, Agent or Firm:
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa