To provide a silica dispersion composition that can obtain a hardened film with superior properties in embedment, resistance to heat and shock, image development, and resolution at an exposure part, and that is suitable for solder resist, etc., and adaptable to a semiconductor package substrate having a small line space (L/S).

The silica dispersion composition contains a silica dispersant made of a polyurethane resin having at least an acidic group and a basic group, silica fine particles, and a thermal cross-linking agent, wherein the amine value of the silica dispersant is 0.65 mmol/g or higher.