Title:
付加的なバックチャンバーを有するシリコンコンデンサマイクロホン及びその製造方法
Document Type and Number:
Japanese Patent JP2012517183
Kind Code:
A
Abstract:
The present invention relates to a fabrication method of a silicon condenser microphone having an additional back chamber. The method of the present invention comprises: applying an adhesive to a substrate and then mounting a chamber casing; curing the adhesive used for adhering the chamber casing; applying an adhesive onto the chamber casing and then mounting a MEMS chip with a mounter; curing the adhesive used for adhering the MEMS chip; and joining the casing and the substrate mounted with components. As the back chamber formed by the chamber casing is added to the back chamber of the MEMS chip, an additional back chamber is provided. Therefore, the silicon condenser microphone fabricated according to the present invention can improve sensitivity by increasing the small back chamber space of the MEMS chip itself and reduce noise including THD (Total Harmonic Distortion).
Inventors:
Song, Chun-Dam
Application Number:
JP2011549080A
Publication Date:
July 26, 2012
Filing Date:
February 11, 2010
Export Citation:
Assignee:
BSE Company Limited
International Classes:
H04R19/04; B81B7/02; B81C3/00; H01L29/84; H04R1/02; H04R31/00
Foreign References:
| WO2007126179A1 | 2007-11-08 |
Attorney, Agent or Firm:
Kurata Masatoshi
Takakura Shigeo
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Morisezo Iseki
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takakura Shigeo
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Morisezo Iseki
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori