Title:
シリコンスラリー廃液の全量リサイクルシステム、クーラント回収液、回収砥粒、及び回収切削粉
Document Type and Number:
Japanese Patent JP5860026
Kind Code:
B2
Abstract:
It is an object of the invention of the present application to provide a recycle system capable of efficiently recovering a coolant recovery liquid, recovery abrasive grain, and recovery cutting powder which have high purity without generating a waste material from silicon slurry waste. A recycle system of silicon slurry waste of the invention of the present application includes: an ultrasonic treatment step (B) of irradiating a separated solid content obtained from silicon slurry waste containing a coolant, an abrasive grain, cutting scrap, and iron scrap with an ultrasonic wave; and a separating step (C) of separating a recovery abrasive grain and recovery cutting powder from the separated solid content irradiated with the ultrasonic wave. Figure 1
Inventors:
Eisuke Kumano
Akamatsu Yoshimoto
Nambae Kaname
Yuka Nakanishi
Akamatsu Yoshimoto
Nambae Kaname
Yuka Nakanishi
Application Number:
JP2013257062A
Publication Date:
February 16, 2016
Filing Date:
December 12, 2013
Export Citation:
Assignee:
Amita Co., Ltd.
International Classes:
B24B57/02; B24B27/06; B24B55/03
Domestic Patent References:
| JP2001009723A | ||||
| JP11048146A | ||||
| JP2010030033A | ||||
| JP2006315099A | ||||
| JP2012076152A | ||||
| JP2011041876A | ||||
| JP2001225070A |
Attorney, Agent or Firm:
Yukihisa Goto
Keisuke Toyota
Keisuke Toyota