To provide a silicone aqueous emulsion type resin composition exerting a wide range of adhesion, a high adhesion strength and a long-term shelf stability using a water dispersion of a polymer without blending any volatile organic compound(VOC) such as an organic solvent and/or plasticizer, and an aqueous emulsion type adhesive and an aqueous putty using this.
A silicone aqueous emulsion type resin composition contains a water dispersion of a polymer, prepared by emulsion copolymerizing a non- silicone, polymerizable unsaturated monomer in the presence of a polymerizable unsaturated monomer having an alkoxysilyl group, an adhesion-imparting resin having an acid number of from 100 to 300 and a compound having both (a) an epoxy group or glycidyl group and (b) an alkoxysilyl group.
KIMOTO AKIRA
Next Patent: THERMOPLASTIC RESIN COMPOSITION AND MOLDED PART THEREOF