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Title:
SILICONE AQUEOUS EMULSION TYPE RESIN COMPOSITION, AQUEOUS EMULSION TYPE ADHESIVE AND AQUEOUS PUTTY
Document Type and Number:
Japanese Patent JP2000191876
Kind Code:
A
Abstract:

To provide a silicone aqueous emulsion type resin composition exerting a wide range of adhesion, a high adhesion strength and a long-term shelf stability using a water dispersion of a polymer without blending any volatile organic compound(VOC) such as an organic solvent and/or plasticizer, and an aqueous emulsion type adhesive and an aqueous putty using this.

A silicone aqueous emulsion type resin composition contains a water dispersion of a polymer, prepared by emulsion copolymerizing a non- silicone, polymerizable unsaturated monomer in the presence of a polymerizable unsaturated monomer having an alkoxysilyl group, an adhesion-imparting resin having an acid number of from 100 to 300 and a compound having both (a) an epoxy group or glycidyl group and (b) an alkoxysilyl group.


Inventors:
YAMAZAKI KAZUAKI
KIMOTO AKIRA
Application Number:
JP36884798A
Publication Date:
July 11, 2000
Filing Date:
December 25, 1998
Export Citation:
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Assignee:
KONISHI CO LTD
International Classes:
C08L43/04; C09D5/34; C09J143/04; (IPC1-7): C08L43/04; C09D5/34; C09J143/04
Attorney, Agent or Firm:
Yoshio Narai (1 person outside)