Title:
シリコーン組成物
Document Type and Number:
Japanese Patent JP6977786
Kind Code:
B2
Abstract:
Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm2/s at 25°C, (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40°C per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m·°C) per 100 total parts by mass of components (A) and (B).
Inventors:
Wataru Toya
Keita Kitazawa
Keita Kitazawa
Application Number:
JP2019564687A
Publication Date:
December 08, 2021
Filing Date:
January 08, 2019
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/07; C08K3/00; C08K5/14; C08L83/05; C08L83/06
Domestic Patent References:
| JP4283265A | ||||
| JP2004506778A | ||||
| JP2010189594A | ||||
| JP2010013495A |
Foreign References:
| WO2016103654A1 |
Attorney, Agent or Firm:
Hideaki International Patent Office