Title:
SILICONE HYBRID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2022175073
Kind Code:
A
Abstract:
To provide a silicone hybrid resin composition that achieves reduction in a storage elastic modulus while maintaining Tg of an organic resin, and demonstrates excellent adhesion to a substrate.SOLUTION: A silicone hybrid resin composition contains the following components (A), (B), (C) with the component (B) being dispersoids dispersed in the component (A). (A) At least one kind of an organic resin selected from a silicone-unmodified epoxy resin and a silicone-modified epoxy resin: 100 pts.mass. (B) An addition-curable silicone resin composition having viscosity of 100-300,000 mPa s at 25°C: 1-300 pts.mass. (C) A curing accelerator for the component (A): 0.01-10 pts.mass.SELECTED DRAWING: None
Inventors:
MAEHARA YUKI
MIZUNASHI TOMOYUKI
KUSHIHARA NAOYUKI
MIZUNASHI TOMOYUKI
KUSHIHARA NAOYUKI
Application Number:
JP2021081212A
Publication Date:
November 25, 2022
Filing Date:
May 12, 2021
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08L63/00; C08G59/18; C08L83/05; C08L83/07
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toru Otsuka
Toshihiro Kobayashi
Toru Otsuka