Title:
SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPH1129757
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To obtain a high-solid pressure-sensitive adhesive compsn. excellent in adhesive properties by adding an org. peroxide or an azo compd. to a reaction product of a polydiorganosiloxane, a soluble silicone resin. and a solvent or a plasticizer selected from among carboxylic acids and amines having a specified b.p. and having the number of carbon atoms specified. SOLUTION: This compsn. is prepd. by adding an org. peroxide or an azo compd. to a reaction of at least one hydroxyl-terminated polydiorganosiloxane having a viscosity at 25 deg.C of 100-100,000,000 mm<2> /s or a mixture of a hydroxyl- terminated polydiorganosiloxane with a monovalent-hydrocarbon-terminated polydiorganosiloxane or an alkenyl-terminated polydiorganosiloxane; a soluble silicone resin comprising R3 SiO1/2 units and SiO4/2 units; and a solvent or plasticizer selected from among 6C or higher carboxylic acids boiling at 200 deg.C or higher and 9C or higher amines.
Inventors:
CIFUENTES MARTIN ERIC
FENTON WILLIAM NEAL
FENTON WILLIAM NEAL
Application Number:
JP7538698A
Publication Date:
February 02, 1999
Filing Date:
March 24, 1998
Export Citation:
Assignee:
DOW CORNING
International Classes:
C08G77/44; C09J155/00; C09J183/05; C09J183/06; C09J183/04; C09J183/07; C09J183/10; (IPC1-7): C09J183/04; C09J183/05; C09J183/06; C09J183/07
Attorney, Agent or Firm:
Takashi Ishida (3 others)