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Title:
SILOXANE DERIVATIVE AND ITS CURED MATERIAL
Document Type and Number:
Japanese Patent JP2008179811
Kind Code:
A
Abstract:

To provide a siloxane derivative appropriate for an optical semiconductor sealing material having high transparency, and capable of forming a cured material excellent in curability, light resistance, heat resistance, adhesion and thermal shock resistance, and an optical semiconductor sealing material composed of the cured material.

The novel siloxane derivative has a principal amount of T-unit structure containing an epoxy group. The cured material is obtained by polymerizing the siloxane derivative. The cured material is appropriate for an optical semiconductor sealing material. The siloxane derivative is prepared by hydrolysis-condensation of a silane having an epoxy group and a hydrolysable group.


Inventors:
MATSUDA TAKAYUKI
TAKAHASHI HIDEAKI
YAMAMOTO HISANAO
Application Number:
JP2007336463A
Publication Date:
August 07, 2008
Filing Date:
December 27, 2007
Export Citation:
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Assignee:
ASAHI KASEI CORP
International Classes:
C08G77/14; C08G59/20; C08G59/42; C08L83/06; H01L23/29; H01L23/31; H01L33/44; H01L33/56
Domestic Patent References:
JPH08259819A1996-10-08
JPH07292108A1995-11-07
JPS6445466A1989-02-17
JP2007016128A2007-01-25
JP2005338790A2005-12-08
JP2007169427A2007-07-05
JP2007169406A2007-07-05
JP2007131782A2007-05-31
JP2006199765A2006-08-03
JP2008120843A2008-05-29
JP2006008747A2006-01-12
JP2006328231A2006-12-07
JP2006225515A2006-08-31
JP2007106798A2007-04-26
Foreign References:
WO2005100445A12005-10-27
Attorney, Agent or Firm:
Hiroyoshi Aoki



 
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