Title:
シルセスキオキサン
Document Type and Number:
Japanese Patent JP6847597
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide novel silsesquioxane, or provide silsesquioxane that can form a cured product having excellent crack resistance (or thermal shock resistance) and excellent adhesion to an adherent.SOLUTION: The present invention provides random-type silsesquioxane including a constitutional unit represented by the following formula (1). [RSiO] (1) [in formula (1), Ris a group containing an epoxy group].SELECTED DRAWING: None
Inventors:
Akihiro Shibamoto
Nobuhiko Harada
Naoko Tsuji
Akira Yamakawa
Nobuhiko Harada
Naoko Tsuji
Akira Yamakawa
Application Number:
JP2016123119A
Publication Date:
March 24, 2021
Filing Date:
June 22, 2016
Export Citation:
Assignee:
Daicel Corporation
International Classes:
C08G59/32; C08G77/14; C09J7/20; C09J163/00; C09J171/00; C09J183/04
Domestic Patent References:
| JP2012214564A | ||||
| JP2011132416A | ||||
| JP2009096865A | ||||
| JP2015212353A |
Foreign References:
| WO2010024119A1 |
Attorney, Agent or Firm:
Goto Patent Office