PURPOSE: To obtain paste having good conductivity and oxidation resistance by containing a prescribed amount of organic binder in silver alloy powder, which is made by quenching and solidifying fusion having predetermined composition using a high pressure atomizing method.

CONSTITUTION: The fusion has such composition as expressed by formulas of Agx, Cuy and Mz (this M stands for one kind or more out of Pb, Bi and Sn), and (x), (y) and (z) in the formula take values in atomic ratio within the ranges of the formula I - the formula IV. Silver alloy conductive paste is formed by containing 5 - 100wt.pts. of organic binder in 100wt.pts. of silver alloy powder, which is made by quenching and solidifying fusion having this composition using a high pressure atomizing method. Thereby such silver paste is obtained having superior conductivity, good oxidation resistance over a long period, excellent soldering characteristic and biting resistance of solder.