導電膜形成のための銀ペースト

Title:

導電膜形成のための銀ペースト

Document Type and Number:

Japanese Patent JP5838541

Kind Code:

B2

Abstract:

The present invention provides a silver paste for forming electrically conductive pattern comprising 0.1 to 60 wt % of a silver C0 to C12 aliphatic carboxylate; 1 to 80 wt % of silver powder; 0.1 to 15 wt % of a binder; and a residual organic solvent. The silver paste composition according to the present invention has advantages in that it produces micro-structures of layers denser than those conventional metal pastes do; shows characteristics of a much lower electric resistance even with a relatively small thickness or a small line width, as compared with the electrically conductive pattern formed from a conventional paste; and allows heat treatment at a very low temperature even without the use of expensive nano-sized metal particles.

Inventors:

Heo, Seung Young
Park, Song Shiru
Han, Seung Jun
Hyun Mun, Jean

Application Number:

JP2009529096A

Publication Date:

January 06, 2016

Filing Date:

May 25, 2007

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