Title:
SILVER POWDER FOR FORMING CONDUCTIVE FILM, CONDUCTIVE PASTE AND METHOD OF FORMING CONDUCTIVE FILM
Document Type and Number:
Japanese Patent JP2014047415
Kind Code:
A
Abstract:
To provide a conductive film excellent in conductivity even when a temperature of a hardening treatment for resin is low such as a touch panel application.
A silver powder used for forming a conductive film is provided by coating 0.01 to 0.2 mass% of dicarboxylic acid to a silver powder material. The dicarboxylic acid is, for example, malonic acid. A conductive paste mixed with, for example, a polyester resin is applied to the silver powder for forming the conductive film, heated to form a conductive film. The invention provides improving conductivity of the conductive film, i.e. reducing resistance of the conductive film even when a temperature of a hardening treatment for the resin is low such as a touch panel application.
Inventors:
SAITO HISASHI
MOGI NORIO
FUJINO TAKEAKI
MOGI NORIO
FUJINO TAKEAKI
Application Number:
JP2012193200A
Publication Date:
March 17, 2014
Filing Date:
September 03, 2012
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO
International Classes:
B22F1/02; B22F1/00; B22F9/00; G06F3/041; H01B1/00; H01B1/22; H01B5/00; H01B13/00
Domestic Patent References:
| JP2012104388A | 2012-05-31 | |||
| JP2011140714A | 2011-07-21 | |||
| JP2011100573A | 2011-05-19 | |||
| JP2012062531A | 2012-03-29 | |||
| JP2012122880A | 2012-06-28 | |||
| JP2013216919A | 2013-10-24 | |||
| JP2011240406A | 2011-12-01 |
Foreign References:
| WO2012060284A1 | 2012-05-10 | |||
| WO2012099161A1 | 2012-07-26 | |||
| WO2011078140A1 | 2011-06-30 | |||
| WO2011155615A1 | 2011-12-15 |
Attorney, Agent or Firm:
Koji Hagiwara
Tetsuo Kanamoto
Miaki Kametani
Kenji Wada
Tetsuo Kanamoto
Miaki Kametani
Kenji Wada