Title:
片面研磨装置及び片面研磨方法、並びに研磨パッド
Document Type and Number:
Japanese Patent JP7156341
Kind Code:
B2
Abstract:
The present invention is a single-side polishing apparatus including: a base turntable having a groove for vacuum suction; a detachable polishing turntable immobilized by vacuum suction; a polishing pad; and a polishing head configured to hold a wafer. The single-side polishing apparatus brings a surface of a wafer held by the polishing head into sliding contact with the polishing pad for polishing. The polishing pad includes a polishing layer configured to polish the wafer surface, a first adhesive layer, a PET sheet layer, a second adhesive layer, an elastic layer, and a third adhesive layer for attachment to the polishing turntable. The layers are sequentially stacked. The polishing pad has a compressibility of 16% or more. This provides a single-side polishing apparatus capable of suppressing NT quality degradation of polished wafer in wafer single-side polishing (particularly, single-side polishing using a vacuum suction-type detachable polishing turntable).
Inventors:
Junichi Ueno
Kaoru Ishii
Kaoru Ishii
Application Number:
JP2020120134A
Publication Date:
October 19, 2022
Filing Date:
July 13, 2020
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
B24B37/24; H01L21/304
Domestic Patent References:
| JP3166396U | ||||
| JP10225863A | ||||
| JP61241059A |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi