Title:
SIZING DIE
Document Type and Number:
Japanese Patent JP2003053822
Kind Code:
A
Abstract:
To provide a sizing die which exhibits high productivity even when a profile molding is molded, prevents the occurrence of nonuniformity and strain in the obtained molding, and is hardly abraded even after repeated molding.
The sizing die 1 is arranged in a post-stage of an extrusion molding mold 2 and cools the molding S extruded from the mold 2 while molding it. A part 11 of the sizing die 1 which correspond to the angular part or the curved part of the molding S is made of a high thermal conductivity material 111 coated with an abrasion resistant material 112.
Inventors:
IMAI TORU
TANAKA SATOSHI
TANAKA SATOSHI
Application Number:
JP2001248929A
Publication Date:
February 26, 2003
Filing Date:
August 20, 2001
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B29C48/90; (IPC1-7): B29C47/90