To manufacture slices in an automated method at an extremely high output, with improved reliability and safety, in uniform and excellent quantity, and at low cost.
A device is provided with a first structure 23 for executing necessary works 24 for manufacturing slices set on a tray or packaged from works collected in the same unit. These works 24 are controlled by a second structure 24, and are mutually connected to form subsidiary groups 26 each comprising a positioning unit, a slicing unit, a processing unit, and a final processing unit. These subsidiary groups 26 are mutually connected by a third structure 27 comprising slice handling and transporting devices for forming mutually connected transport chains having compatibility to all the elements.
WO/1999/067054 | WAFER EDGE POLISHING METHOD AND APPARATUS |