SLIT DEVICE FOR STRUCTURE

Japanese Patent JP3343681

B2

PROBLEM TO BE SOLVED: To improve work efficiency by adding binder to a cut and heated curly waste magnetic tape, pressure-molding the same into a plate, and providing a joint material in the longitudinal direction of the side.
SOLUTION: Binder is added to a cut or crushed and heated curl-like waste magnetic tape, and pressure-molded to form a rectangular plate-like board 1. Secondly, a synthetic resin-made joint material 2 having a recessed joint part 3 on the outside and having an applied part 5 formed by projecting pieces arranged side by side at intervals of the thickness of the board on the inside is fitted to one side of the board 1. Or, a short side of a synthetic resin-made long material having a trapezoidal section is removably fitted to the end side of the board by an adhesive tape or the like. At the time of construction, the joint material 2 is nailed on a designated position of an outer wall form, and after one side of the board 1 is fitted to the applied part 5, an inner wall form is erected, and the board 1 is nailed from the outside thereof. Thus, the slit device can be easily installed and can be nailed because the strength in the shearing direction and the nail holding force of the board are high, and further the slit deice can cope with various installation methods so as to reduce the cost.

Shinya Fukutomi

JP19818799A

November 11, 2002

July 12, 1999

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Marui Sangyo Co., Ltd.
Fuji Chemical Industry Co., Ltd.

E04B2/84; E04G9/05; E04G15/06; (IPC1-7): E04G15/06; E04B2/84; E04G9/05

JP893266A
JP7256667A
JP6198649A
JP6271244U

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